Specification
| System | |
|---|---|
| Processor | Support 10th Gen Intel® CML S Processor (LGA 1200, 35W TDP) – Intel® Core™ i9-10900TE, 10 Cores, 20MB Cache, up to 4.5 GHz, TDP 35W – Intel® Core™ i7-10700TE, 8 Cores, 16MB cache, up to 4.4 GHz, TDP 35W – Intel® Core™ i5-10500TE, 6 Core, 12MB Cache, up to 3.7 GHz, TDP 35W – Intel® Core™ i3-10100TE, 4 Cores, 9MB Cache, up to 3.6 GHz, TDP 35W – Intel® Pentium® G6400TE, 2 Cores, 4MB Cache, 3.2 GHz, TDP 35W – Intel® Celeron® G5900TE, 2 Cores, 2MB Cache, 3.0 GHz, TDP 35W |
| System Chipset | Intel® Q470E Express Chipset |
| LAN Chipset | GbE1: Intel I219 (Support Wake-on-LAN and PXE) 2.5 GbE2: Intel I225 (Support Wake-on-LAN and PXE) |
| Audio Codec | Realtek ALC888S |
| System Memory | 2x 260-Pin DDR4 2666/2933MHz SODIMM. Max. up to 64GB |
| BIOS | AMI 256Mbit SPI BIOS |
| Watchdog | Software Programmable Supports 1~255 sec. System Reset |
| TPM | TPM 2.0 |
| Display | |
|---|---|
| DisplayPort | 3x DisplayPort 1.4a, support resolution 4096 x 2304 (1x DP Port Co-layout HDMI Connector) |
| HDMI | Yes, Shared by 1x DP port |
| Multiple Display | Triple Display |
| Storage | |
|---|---|
| mSATA | 1x mSATA |
| SIM Socket | 2x External SIM socket (Mini PCIe attached) |
| SSD/HDD | 1x Internal 2.5″ SATA HDD Bay (support H=9mm) 1x Removable 2.5″ SATA HDD Bay (support H=7mm, hot-swappable) Support RAID 0, 1, 5 |
| Expansion | |
|---|---|
| M.2 | 1x M.2 (E Key, PCIe x1, USB 2.0, 2230), 1x M.2 B Key, 2242/3042/3052 (PCIex2, Support AI Module/NVMe Storage) (PCIex1&USB 3.2 Gen1, Support 4G/5G) |
| Mini PCIe | 1x Full-size Mini PCIe |
| Expansion Modules | Occupied One Universal I/O Slot: • 4-port GbE module with Intel® I350 Chipset, RJ-45 or M12 connector (PoE optional) • 2-Port 10GbE RJ45 with Intel X710 Chipset • 4-Port USB with Renesas uPD720201K8 host controller (share PCIe Gen2 x1 bandwidth) • 1x M.2 M-Key (PCIe x4 Lane, 2242/2260) for NVMe/AI Module • 2x M.2 B-Key 2242/3042/3052: – 2x M.2 (PCIe x2 Lane) for NVMe/AI Module – 1x M.2 (PCIe x2 Lane) for NVMe/AI Module and 1x M.2 (PCIe x1 Lane + USB 3.2 Gen 1) for 4G/5G Module, 1x External SIM socket (M.2 attached) |
| Operating System | |
|---|---|
| Windows | Windows 10/11 |
| Linux | Linux kernel |
| I/O | |
|---|---|
| Audio | 1x Line-out |
| CAN | 2x CAN 2.0 A/B 2-pin Internal header |
| COM | 3x RS-232/422/485 ; 2x RS-232/422/485 (internal) |
| DIO | 8 in / 8 out (Isolated) |
| LAN | 2x RJ45 |
| Universal I/O Bracket | 1x Universal I/O Bracket (By mini PCIe interface) |
| USB | 6x USB 3.2 Gen 2 (10Gbps) 1x USB 3.2 Gen 1 (5 Gbps, internal) 1x USB 2.0 (internal) |
| Others | 5x WiFi Antenna Holes 1x Power Switch, 1x AT/ATX Switch, 1x Remote Power On/Off 1x PC/Car Mode Switch, 1x Delay Time Switch 1x CMOS Battery 1x 4-Pin FAN Connector |
| Power | |
|---|---|
| Power Mode | AT, ATX |
| Power Supply Voltage | 9~48VDC |
| Power Ignition Sensing | Power Ignition Management |
| Power Connector | 3-pin Terminal Block |
| Power Adaptor | Optional AC/DC 24V/5A, 120W Optional AC/DC 24V/9.2A, 220W |
| Power Protection | OVP (Over Voltage Protection) OCP (Over Current Protection) Reserve Protection |
| Environment | |
|---|---|
| Operating Temp. | -25°C to 70°C (35W CPU) |
| Storage Temp. | -30°C to 85°C |
| Relative Humidity | 10% to 95% (non-condensing) |
| Vibration | IEC60068-2-64:2008 With HDD: 1 Grms (5 – 500 Hz, 0.5 hr/axis) With SSD: 5 Grms (5 – 500 Hz, 0.5 hr/axis) Designed to comply with MIL-STD-810G Method 514.7 Procedure I |
| Shock | IEC60068-2-27:2008 With SSD: 50G half-sin 11ms Designed to comply with MIL-STD-810G Method 516.7 Procedure I |
| Standards / Certification | UL, CE, FCC Class A, EMC Conformity with EN50155 & EN50121-3-2 |
| Physical | |
|---|---|
| Construction | Extruded Aluminum with Heavy Duty Metal |
| Dimension | 192 (W) x 227 (D) x 60.3 (H) mm |
| Weight | 3.3kg – 4.1 kg |
| Mounting | Wall Mounting |
- For 10th CPUs configured to run at 35W, operating temperatures will be limited to 70°C.
- 35W CPUS may experience thermal throttling depending on extreme application workloads; this is also due to an increase in the physical CPU cores from the Intel silicon (up to 10 cores). Please note, this does not indicate system malfunction or problems in the fanless design. Please consult our embedded engineers for the best configuration to match your application requirements.
- All specifications and photos are subject to change without notice.
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